DAIS 2023 - 23rd International Conference on Distributed Applications and Interoperable Systems

DAIS 2023 is one of the three conferences of DisCoTec 2023.

Scope

The DAIS conference series addresses all practical and conceptual aspects of distributed applications, including their design, modeling, implementation and operation, the supporting middleware, appropriate software engineering methodologies and tools, as well as experimental studies and applications. Submissions will be judged on their originality, significance, clarity, relevance, and technical correctness.

The topics of interest to the conference include, but are not limited to:

Novel and innovative distributed applications and systems, particularly in the areas of

• middleware,
• cloud, edge and fog computing,
• big data processing,
• streaming and complex event processing,
• distributed social networking,
• IoT and cyber-physical systems,
• mobile computing,
• advanced networking (SDN/NFV),
• micro-services and service-oriented computing,
• peer-to-peer systems, and
• data center and internet-scale systems.

Novel architectures and mechanisms, particularly in the areas of

• publish/subscribe systems,
• epidemic protocols,
• language-based approaches,
• virtualization and resource allocation,
• distributed storage,
• trusted execution environments,
• blockchains, cryptocurrencies and smart contracts, and
• distributed consensus mechanisms.

System issues and design goals, including

• interoperability and adaptation,
• self-* properties (e.g., self-organization, self-management,…),
• security and practical applications of cryptography,
• trust and privacy,
• cooperation incentives and fairness,
• fault-tolerance and dependability,
• scalability and elasticity, and
• tail-performance and energy-efficiency.

Submission dates

• Abstract submission: February 11, 2023 March 4, 2023 (Extended)
• Paper submission: February 18, 2023 March 4, 2023 (Extended)
• Paper notification: March 31, 2023 April 7, 2023
• Artefact submission: April 14, 2023
• Artefact notification: April 28, 2023
• Camera-ready: April 30, 2023
• DisCoTec conference: June 19-23, 2023

Deadlines expire at 23:59 anywhere on earth on the dates displayed above.

Submission and Publication

All papers must be original, unpublished, and not submitted for publication elsewhere. DAIS 2023 offers three submission tracks:

• Full research papers in no more than 15 pages + 2 pages references.
• Full practical experience reports, including experimental and evaluation studies, case studies, and practice reports in no more than 15 pages + 2 pages references.
• Work-in-progress papers, describing ongoing work and interim results, in no more than 6 pages + 2 pages references.

Contributions should be submitted electronically as PDF, using the Springer LNCS style to the conference submission website. Each paper will undergo a thorough process of peer reviews by the Program Committee. Reviewing is single-blind: author name(s) should appear.

Proceedings

All papers accepted in any of the conference tracks will be included in the conference proceedings, which will be published by Springer-Verlag in in LNCS-IFIP volumes. Proceedings will be made available at the conference. Submission implies that at least one author will register and attend the conference if the paper is accepted.

Artefact Submission

To improve the reproducibility of results and to increase the visibility of prototypes and tools produced by our community, authors of accepted papers (full papers, experience reports, WiP papers) will be invited to submit publicly available artefacts associated with their paper for evaluation. Based on the result of the evaluation, the paper may be awarded with badges. Artefact submission is optional and the result of the artefact evaluation will not alter the paper’s acceptance decision. Detailed guidelines for the preparation and submission of the artefacts will be made available to authors.

Submission link

https://easychair.org/my/conference?conf=dais2023

Keynote speaker

• Peter Pietzuch, Imperial College London, UK

Program committee chairs

• Marta Patino-Martínez (Technical University of Madrid, Spain)
• João Paulo (University of Minho, Portugal)

Program committee

• Ainhoa Azqueta, Universidad Politécnica de Madrid, Spain
• Claudio Mezzina, University Urbino, Italy
• Daniel O’Keeffe, Royal Holloway University of London, England
• Davide Frey, INRIA, France
• Emanuel Onica, Alexandru Ioan Cuza University of Iasi, Romania
• Evangelia Kalyvianaki, University of Cambridge, UK
• Etienne Riviére, Ecole Polytechnique de Louvain, Belgium
• Fábio Coelho, INESC TEC & U. Minho, Portugal
• Fábio Kon, University of São Paulo, Brazil
• Hans P. Reiser, Reykjavík University, Iceland
• Hein Meling, University of Stavanger, Norway
• João Leitão, Universidade Nova de Lisboa, Portugal
• Kostas Magoutis, University of Ioannina, Greece 
• Miguel Matos, IST INESC-ID, Universidade de Lisboa, Portugal
• Pierre-Louis Aublin, IIJ Research Laboratory, Japan
• Pierre Sutra, Telecom SudParis, France
• Romain Rouvoy, University of Lille, France
• Silvia Bonomi, Università degli Studi di Roma “La Sapienza”, Italy
• Spyros Voulgaris, Athens University of Economics and Business, Greece
• Valerio Schiavoni, University of Neuchâtel, Switzerland
• Vana Kalogeraki, Athens University of Economics and Business, Greece
• Vincenzo Gulisano, Chalmers University, Sweden

Artefact Evaluation Committee

• António Sousa (chair), INESC TEC & U. Minho, Portugal
• Bijun Li, Hainan Normal University, China
• Cláudia Brito, INESC TEC & U. Minho, Portugal
• Christian Berger, University of Passau, Germany
• Giovanni Farina, Sapienza University of Rome, Italy
• Nuno Dionísio, LASIGE & Faculdade de Ciências, Universidade de Lisboa, Portugal
• Robin Vassantlal, LASIGE & Faculdade de Ciências, Universidade de Lisboa, Portugal
• Tânia Esteves, INESC TEC & U. Minho, Portugal
• Vinícius Vielmo Cogo (chair), LASIGE & Faculdade de Ciências, Universidade de Lisboa, Portugal

Steering committee

• Lydia Y. Chen, TU Delft, Netherlands
• Frank Eliassen, University of Oslo, Norway
• Rüdiger Kapitza, Technical University of Braunschweig, Germany
• Rui Oliveira, University of Minho / INESC TEC, Portugal
• Hans P. Reiser, University of Passau, Germany
• Laura Ricci, University of Pisa, Italy
• Silvia Bonomi, Università degli Studi di Roma “La Sapienza”, Italy
• Etienne Riviére, Ecole Polytechnique de Louvain, Belgium
• Jose Pereira, University of Minho / INESC TEC, Portugal
• Luís Veiga, INESC-ID, Universidade de Lisboa, Portugal – Chair

More Information

For additional information, please contact the Program Committee Co-chairs: dais2023@easychair.org

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